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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D743
BZA900AVL series Quadruple low capacitance ESD suppressor
Product data sheet Supersedes data of 2003 Apr 15 2003 Oct 20
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
FEATURES * Low diode capacitance * Low leakage current * SOT665 surface mount package * Common anode configuration. APPLICATIONS * Communication systems * Computers and peripherals * Audio and video equipment. DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression. MARKING TYPE NUMBER BZA956AVL BZA962AVL BZA968AVL ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BZA956AVL BZA962AVL BZA968AVL - - - DESCRIPTION plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads MARKING CODE V3 V2 V1
1 2 3
handbook, halfpage 5
BZA900AVL series
PINNING PIN 1 2 3 4 5 cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION
4 1 3 2 4 5
MGW315
Fig.1 Simplified outline (SOT665) and symbol.
VERSION SOT665 SOT665 SOT665
2003 Oct 20
2
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM Ptot PZSM Tstg Tj ESD working current continuous forward current non-repetitive peak forward current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature electrostatic discharge HBM MIL-Std 883 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD IEC 61000-4-2, level 4 (ESD) HBM MIL-Std 883, class 3 THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point; note 1 CONDITIONS all diodes loaded one diode loaded all diodes loaded >4 kV Tamb = 25 C Tamb = 25 C tp = 1 ms; square pulse Tamb = 25 C; note 2; see Fig.5 square pulse; tp = 1 ms PARAMETER CONDITIONS
BZA900AVL series
MIN. - - - - - -65 -
MAX.
UNIT
note 1 200 3.5 335 6 +150 150 - -
mA mA A mW W C C kV kV
IEC 61000-4-2 (contact discharge) 15 10
CONDITIONS >15 kV (air); >8 kV (contact discharge)
VALUE 370 135 125
UNIT K/W K/W K/W
Note 1. Solder point of common anode (pin 2).
2003 Oct 20
3
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current BZA956AVL BZA962AVL BZA968AVL VZ working voltage BZA956AVL BZA962AVL BZA968AVL rdif differential resistance BZA956AVL BZA962AVL BZA968AVL SZ temperature coefficient BZA956AVL BZA962AVL BZA968AVL Cd diode capacitance BZA956AVL BZA962AVL BZA968AVL diode capacitance BZA956AVL BZA962AVL BZA968AVL IZSM non-repetitive peak reverse current BZA956AVL BZA962AVL BZA968AVL tp = 1 ms; Tamb = 25 C - - - f = 1 MHz; VR = 5 V - - - f = 1 MHz; VR = 0 - - - IZ = 1 mA - - - IZ = 1 mA - - - VR = 3 V VR = 4 V VR = 4.3 V IZ = 1 mA 5.32 5.89 6.46 - - - CONDITIONS IF = 200 mA - MIN.
BZA900AVL series
TYP. - - - - 5.6 6.2 6.8 - - - 1.3 2.4 2.9 22 18 16 12 9 8 - - -
MAX. 1.2 200 100 20 5.88 6.51 7.14 200 150 100 - - - 28 22 19 17 12 11 0.90 0.85 0.80
UNIT V nA nA nA V V V mV/K mV/K mV/K pF pF pF pF pF pF A A A
2003 Oct 20
4
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, halfpage
10
MLE001
102 handbook, halfpage
MLE003
IZSM (A)
PZSM (W) BZA956AVL BZA956AVL
1
10 BZA968AVL BZA962AVL/BZA968AVL
BZA962AVL
10-1 10-2
10-1
1
tp (ms)
10
1 10-2
10-1
1
tp (ms)
10
Fig.3 Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time.
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
handbook, halfpage
26 Cd 22
MLE002
MGT586
handbook, halfpage
400
(pF)
Ptot (mW) 300
18
200
BZA956AVL 14 BZA962AVL
100
10 BZA968AVL 6 0 1 2 3 4 VR (V) 5
0 0 50 100 Tamb (C) 150
Tj = 25 C; f = 1 MHz.
Fig.4
Diode capacitance as a function of reverse voltage; typical values.
Fig.5 Power derating curve.
2003 Oct 20
5
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, full pagewidth
ESD TESTER RZ CZ
450
RG 223/U 50 coax
10x ATTENUATOR note 1
DIGITIZING OSCILLOSCOPE
50
IEC 1000-4-2 network CZ = 150 pF; RZ = 330
1/4 BZA900AVL
Note 1: attenuator is only used for open socket high voltage measurements
vertical scale = 200 V/div horizontal scale = 50 ns/div
vertical scale = 5 V/div horizontal scale = 50 ns/div
BZA968AVL GND3
BZA962AVL GND2
GND GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network)
BZA956AVL
clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network)
GND
GND
vertical scale = 200 V/div horizontal scale = 50 ns/div
vertical scale = 5 V/div horizontal scale = 50 ns/div
unclamped -1 kV ESD voltage waveform (IEC 1000-4-2 network)
clamped -1 kV ESD voltage waveform (IEC 1000-4-2 network)
MLE005
Fig.6 ESD clamping test set-up and waveforms.
2003 Oct 20
6
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
APPLICATION INFORMATION Typical common anode application
BZA900AVL series
A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8.
handbook, full pagewidth
keyboard, terminal, printer, etc.
I/O
A B C D FUNCTIONAL DECODER
BZA900AVL GND
MLE008
Fig.7 Computer interface protection.
handbook, full pagewidth
VDD address bus VGG
RAM
ROM
I/O
data bus
CPU CLOCK
control bus
BZA900AVL GND
MLE009
Fig.8 Microprocessor protection.
2003 Oct 20
7
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point.
BZA900AVL series
2003 Oct 20
8
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
PACKAGE OUTLINE
BZA900AVL series
Plastic surface mounted package; 5 leads
SOT665
D
A
E
X
S
YS HE
5
4
A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT665
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 01-01-04 01-08-27
2003 Oct 20
9
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD suppressor
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION
BZA900AVL series
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
2003 Oct 20
10
NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R76/03/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11935

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